深圳pcb制板-高TG主板

Release time：2019-03-29 Editor author：Jin Zhi Zhu Read：9864

特点：深圳pcb制板该项目需压接工艺，对压接孔径公差要求严格，公差+/-0.05mm

层数：12 层

板材：高TG FR4

板厚：2.0mm

单板大小：292X249.6mm

表面处理工艺：沉金

铜厚：1OZ（其中内层铜厚需阴阳铜配对）

线宽/线距：4/4mil

孔径：0.2mm

阻抗控制：10% 油墨 深圳pcb制板

Previous：PCB制板-高TG半孔板

Statement: This article originates from the integration of Jin Zhizhuo's official website, such as copyright issues related to articles and manuscripts. Please contact us in time, and we will deal with them as soon as possible.
Title: Temperature Detection Method for Temperature Control Switches web：http://www.gtl-tech.com/news/12.html

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