十层三阶HDI板

Release time：2019-08-28 Editor author：Jin Zhi Zhu Read：27739

层数： 10L

板厚： 1.2mm

特殊要求：树脂塞孔

表面处理：沉金

材料：FR-4 TG170

外层线宽/线距: 2.95/2.95mil

内层线宽/线距: 2.36/2.36mil

最小孔径：盲孔0.1mm，埋孔0.2mm，通孔0.2mm

铜厚：外层1oz，内层0.5oz & 1oz

十层三阶HDI板-1.jpg

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Title: Temperature Detection Method for Temperature Control Switches web：http://www.gtl-tech.com/news/12.html

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